Lapox Fillo - Epoxy adhesive

Lapox Fillo

Lapox Fillo is two component modified, thixotropic epoxy adhesive system. When both components are mixed in recommended ratios and cured appropriately at room temperature, an excellent bond strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood, textile and natural stones. Faster productivity can be achieved, if curing is performed at higher temperature between 40°C and 60°C. Curing at higher temperature is recommended to achieve optimum bond strength.

Application:

1. Joint filling system for flooring

2. Potting system for small electronics

3. Wood adhesive for wood industries

Advantages:

1. Good electrical insulating properties

2. High bond strength Mechanical strength even in dynamic conditions

3. Thermally stable and suitable to perform in extreme conditions

4. Water and chemical resistant